Brief description of embodiments of a shielding between two under - sets of a microcircuit and application of this method has the embodiment of a monolithic circuit comprising two integrated under - assemblies thus insulated with respect

摘要

Method of producing shielding between two sub-assemblies of a microcircuit, characterised in that it comprises the steps of: a. Preparing a monocrystalline semiconductor substrate intended to receive a monolithic integrated circuit formed by several sub-assemblies; b. Delimiting an earth region at the surface of the substrate between the sub-assemblies to be insulated by shielding; c. Etching the rear face of the substrate so as to reduce the latter's thickness in a region corresponding, on the rear face, at least to the earth region defined on the front face; d. Producing passages in the rear face, by etching, which allow the rear face and the front face of the substrate to communicate within the region of reduced thickness; e. Metallising, with a metal suitable for forming an earth plane, the region delimited for this purpose on the front face, all or part of the rear face including the region of reduced thickness, and the walls of the passages, so as to obtain electrical connection between the earth plane of the front face and the rear metallisation; f. Using this earth plane as earth for the sub-assemblies of the integrated circuit. Application: production of a monolithically integrated microwave antenna reception head. IMAGE