首页>
外国专利>
Bath and process for plating lead and lead/tin alloys
Bath and process for plating lead and lead/tin alloys
展开▼
机译:镀铅和铅/锡合金的镀液和工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, an alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound.
展开▼