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INSPECTING METHOD FOR BONDING SURFACE PARALLELISM OF TAB BONDER

机译:胶粘剂粘结面平行度的检测方法

摘要

PURPOSE:To eliminate the uncertainly and to reduce the number of inspecting steps by placing a parallelism inspecting plate on which a thin aluminum film is deposited on a flat glass plate on a stage, inspecting the parallelism by a TAB bonding tool, pressurizing and heating, checking the pressurized portion of the plate, and inspecting the parallelism of the bonding surface. CONSTITUTION:A TAB bonder is formed of a TAB bonder stage 1 and a TAB bonding tool 5, and a parallelism inspecting plate 9 placed on the stage 1 is formed by depositing aluminum 9b on a glass plate 9a in the thickness of approx. 1mum. To inspect the parallelism by using the plate 9, the plate 9 placed on the stage 1 is pressurized by the tool 5, and heated at 400 deg.C for approx. 3sec. At this time, the aluminum 10 is softened by heating the tool 5, and since the thickness of the aluminum film is approx. 1mum, only the portion pressurized by the pressure of the tool 5 is recessed at 1mum or less.
机译:目的:为消除不确定性并减少检查步骤的数量,方法是在平台上的平板玻璃板上放置一块沉积有薄铝膜的平行度检查板,然后用TAB键合工具检查平行度,然后加压并加热,检查板的受压部分,并检查粘合表面的平行度。组成:一个TAB键合机由一个TAB键合机台1和一个TAB键合工具5组成,放置在载物台1上的平行度检查板9是通过在玻璃板9a上沉积约9mm厚的铝9b而形成的。 1分钟为了通过使用板9检查平行度,通过工具5对放置在平台1上的板9进行加压,并在400℃下加热约2℃。 3秒此时,通过加热工具5来使铝10软化,并且由于铝膜的厚度约为2mm。在1μm的情况下,仅通过工具5的压力加压的部分凹入1μm以下。

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