首页> 外国专利> CU-AG-TIB2 TYPE SINTERED MATERIAL

CU-AG-TIB2 TYPE SINTERED MATERIAL

机译:CU-AG-TIB2型烧结材料

摘要

PURPOSE:To improve the hardness at room temp., the hardness and electric conductivity after holding at high temp. by uniformly dispersing a prescribed percentage of TiB2 of a prescribed particle size in a matrix of a solid soln. of Ag in Cu. CONSTITUTION:A Cu-Ag-TiB2 type sintered material is obtd. by uniformly dispersing 0.5-18wt% TiB2 of =1mum particle size in a matrix of a solid soln. of Ag in Cu. The hardness of the composite reinforced sintered material at room temp., the hardness and electric conductivity after holding at high temp. are improved and the material is used as a contact point material, an electrode material or a material for a lead frame or the like.
机译:目的:为提高室温硬度,高温保持后的硬度和导电性。通过将规定百分比的规定粒度的TiB2均匀地分散在固体溶液的基质中。铜中的银含量组成:Cu-Ag-TiB2型烧结材料。通过将小于等于= 1的粒径的0.5-18wt%的TiB 2均匀地分散在固体溶液的基质中。铜中的银含量室温下复合增强烧结材料的硬度,高温保持后的硬度和电导率。改进了该材料,并将该材料用作接触点材料,电极材料或用于引线框架的材料等。

著录项

  • 公开/公告号JPS62247040A

    专利类型

  • 公开/公告日1987-10-28

    原文格式PDF

  • 申请/专利权人 ASAHI GLASS CO LTD;

    申请/专利号JP19860088228

  • 发明设计人 IMAGAWA MAKOTO;HAMASHIMA KAZUO;

    申请日1986-04-18

  • 分类号C22C9/00;C22C32/00;

  • 国家 JP

  • 入库时间 2022-08-22 07:26:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号