HIGHLY THERMALLY CONDUCTIVE EPOXY RESIN MOLDING MATERIAL

摘要

PURPOSE:To provide the titled molding material having excellent moldability, wear resistance and moisture resistance, containing crystalline silica whose surface is made amorphous by modification. CONSTITUTION:An epoxy resin is blended with a filler comprising spherical crystalline silica whose surface layer of 3mum or below in thickness is made amorphous by modification, a hardener, a curing accelerator, a parting agent, etc.