PREPARATION OF DRY ETCHING RESISTANT BOTH POSITIVE AND NEGATIVE TYPE PHOTORESIST

摘要

PURPOSE:To obtain a dry etching resistant photoresist usable as both of negative and positive types by successively laminating a photosensitive resin composition layer composed of a substance having quinonediazide structures and a silicone rubber layer, imagewise exposing it, and processing it with a base. CONSTITUTION:7503The photosensitive resin composition layer composed of a substance having quinone diazide structures, and the silicone rubber layer are successively laminated to form the photoresist for use in micropattern forma tion necessary for fabrication of semiconductors, magnetic bubble memory elements, integrated circuits, and the like. The photoresist is imagewise exposed and processed with a base, thus permitting dry etching resistance usable for both of negative and positive types to be obtained.