apparatus for training, from the top to the bottom of a stack of boards and the drain of the same stack in a corresponding container

• 1. 从一叠金属板中分送各块板的方法和实现该方法的装置 [P] . 中国专利： CN1034490C . 1997.04.09
• 2. 从一叠金属板中分送各块板的方法和实现该方法的装置 [P] . 中国专利： CN1080612A . 1994-01-12
• 3. apparatus for training, from the top to the bottom of a stack of boards and the drain of the same stack in a corresponding container [P] . IT8304954V0 . 1983-07-26

  机译： 用于训练的设备，从一叠板的顶部到底部，以及同一叠板的排水口在相应的容器中

• 4. apparatus for training, from the top to the bottom of a stack of boards and the drain of the same stack in a corresponding container [P] . IT8303510D0 . 1983-07-26

  机译： 用于训练的设备，从一叠板的顶部到底部，以及同一叠板的排水口在相应的容器中

• 5. Stackable flat topped container - has bosses and recesses in top and bottom engaging with other containers to keep stacks together [P] . 法国专利： FR2455551A1 . 1980-11-28

  机译： 可堆叠的平顶容器-在顶部和底部具有与其他容器接合的凸起和凹槽，以将堆叠保持在一起

• 1. Stacking Sequence of Marine Container Minimizing Space in Container Terminals [J] . Ning Zhang, Yutaka Watanabe 交通与运输工程：英文版 . 2016,第002期
• 2. Recent developments on corrosion behaviors of Mg alloys with stacking fault or long period stacking ordered structures [J] . Yujin Nie, Jianwei Dai, Xuan Li, 镁合金学报（英文） . 2021,第004期
• 3. Stacking fault probability and stacking fault energy in CoNi alloys [J] . 周伟敏, 江伯鸿, 刘岩, 中国有色金属学报（英文版） . 2001,第004期
• 4. Geek Talents:Who are the Top Experts on GitHub and Stack Overflow? [J] . Yijun Tian, Waii Ng, Jialiang Cao, 计算机、材料和连续体(英文) . 2019,第008期
• 5. Gate stack thermal stability and PBTI reliability challenges for 3D sequential integration: Demonstration of a suitable gate stack for top and bottom tier nMOS [C] . J. Franco, L. Witters, A. Vandooren, International Reliability Physics Symposium . 2017
• 6. Reliability of Copper-Filled Stacked Microvias in High Density Interconnect Circuit Boards [D] . Ning, Yan. 2017
• 7. The Golgi apparatus in the endomembrane-rich gastric parietal cells exist as functional stable mini-stacks dispersed throughout the cytoplasm [O] . Priscilla A. Gunn, Briony L. Gliddon, Sarah L. Londrigan, -1
• 8. Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application [O] . Jiujuan Li, Yuanming Chen, Yongqiang Li, 2016

• 1. 基于Sentinel TOPS模式Stacking技术监测淮南矿区沉降 [J] . 张晓博 ,赵学胜 ,葛大庆 . 国土资源遥感 . 2018,第004期
• 2. 柔性矿脂防腐密封油带保护系统在储油罐底部边缘板防腐中的应用 [C] . 贺爱群 ,任刚 ,唐维琴 . 中国油气田地面工程技术交流大会 . 2013
• 3. 相变材料板用于济南办公建筑节能及相应空调运行策略优化 [A] . 张恕振 . 2018