METHOD AND DEVICE FOR AUTOMATIC QUALITY ASSURANCE IN WIRE MOUNTING PROCESSES

摘要

The invention relates to a method and a device for automatic quality assurance in wire-mounting processes, in particular during wire bonding of electronic components. The aim of the invention is to exclude Fehlkontaktierungen and produce each bondable contact point quality. The task is to design and monitor each individual point of contact during wire assembly automatically with the optimum process parameters for it, and to correct them if necessary. According to the invention, the properties of the bonding pad are measured without contact in an automatic measurement and control process, and the resulting actual value is fed to a bonder via a processing unit, followed by a controlled adjustment of the bond parameters to the properties of the bond pad of the component. During the bonding process, an optical measurement is constantly performed to check and trigger a correction to an optimum target value. The device has a sensor 1 with evaluation logic 2, which communicates with the bonder 7 via a processing unit 4. A sensor 6 is directly coupled to the processing unit 4. figure