High-temperature environment test apparatus for semiconductor device and its operation method

摘要

The holding device includes a heat block having a heat source therein, and a cooling block for cooling the microstrip matching circuits and coaxial connectros. Both blocks are spatially isolated from each other by an air space. The semiconductor device is set on the top surface of the heat block. As a result the semiconductor device is effectively heated up to the predetermined testing temperature, while the microstrip matching circuits and the conncetors are protected from the temperature rise caused by the heat flow from the heat block. Appropriate grounding arrangements for the semiconductor device are provided by a metal foil for projections on the side walls of the cooling block.