首页> 外国专利> A METHOD OF HIGH SPEED ELECTROPLATING PALLADIUM AND PALLADIUM ELECTROPLATING SOLUTION THEREFOR

A METHOD OF HIGH SPEED ELECTROPLATING PALLADIUM AND PALLADIUM ELECTROPLATING SOLUTION THEREFOR

机译:一种高速电镀钯的方法及钯电镀溶液

摘要

A method of high speed electroplating and a palladium electroplating solution to produce lustrous crack-free palladium deposits, the solution comprising palladium metal at a concentration above about 10 g/l, a pH between about 7 and 9, and having a phosphate or carbonate anion concentration sufficient to create acceptable deposits at a current density delta of about 200 ASF and above at jet agitation speeds above about 125 inches per second and a current density delta of about 50 ASF at a cathode agitation speed above 3 inches per second, said solution being free of quaternized pyridinium brightening agents.
机译:一种高速电镀的方法和电镀钯溶液以产生光泽无裂纹的钯沉积物,该溶液包含浓度约为10 g / l以上的钯金属,pH值约为7至9,并且具有磷酸根或碳酸根阴离子浓度足以在每秒约125英寸/秒以上的喷射搅拌速度下以约200 ASF及以上的电流密度delta和在每秒3英寸以上的阴极搅拌速度下产生约50 ASF的电流密度delta产生可接受的沉积物,所述溶液为不含季铵化吡啶鎓增白剂。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号