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Controlled collapse thermocompression gang bonding
Controlled collapse thermocompression gang bonding
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机译:可控塌陷热压帮结
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摘要
Controlled shape bumps are fabricated into the metal contact fingers that are to be used in the gang bonding assembly of semiconductor devices. The bump shape permits the gang bonding of a plurality of contact fingers simultaneously while producing reliable, uniformly high strength bonds.
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