SEMICONDUCTOR PACKAGE EQUIPPED WITH POWER SOURCE NOISE COUNTERMEASURE

摘要

PURPOSE:To provide durability against a power source noise, to eliminate an external connection of a capacitor and to improve a mounting density by incorporating the capacitor in a package, and connecting a capacitor durable against a power source noise from a power source to a ground wiring. CONSTITUTION:A capacitor 6 is connected to be contained from a metallized wiring 3a of Vcc side to a metallized wiring 3b of a GND side, and connected to the vicinity of a semiconductor chip 5. Accordingly, since the influence of the inductance of a conventional lead wiring can be avoided and a distance between the capacitor 6 and the chip 5 is shortened, the inductance of the wirings 3 and leads 4 can be reduced. Since the capacitor 6 durable against a power source noise is contained in a package 1, it is not necessary to connect the capacitor specially by an outer attachment.