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High speed junction field effect transistor for use in bipolar integrated circuits

机译:用于双极集成电路的高速结型场效应晶体管

摘要

A high speed BIFET junction field effect transistor is formed in an epitaxial layer (10) of one conductivity type and includes source (18) and drain (20) regions of opposite conductivity type interconnected by a channel region (24) of the opposite conductivity type. A surface layer (26) of the one conductivity type is formed over the channel region, and a highly conductive contact (32) is formed on the surface layer intermediate the source and drain regions. The surface layer can include a region (30) beneath the contact of high dopant concentration of the one conductivity type. The surface contact (32) can comprise highly doped polycrystalline silicon material with or without a metal layer on the surface thereof. Alternatively, the surface contact (32) can comprise a barrier metal contacting the surface layer and a second metal overlying the barrier metal. The surface contact and the epitaxial layer underlying the channel region comprises gates for the field effect transistor. Increased speed of operation comes from the increased conductivity of the surface contact and the limited size and thus reduced capacitance of the surface contact.
机译:高速BIFET结场效应晶体管形成在一种导电类型的外延层(10)中,并且包括通过相反导电类型的沟道区域(24)互连的相反导电类型的源极(18)和漏极(20)区域。在沟道区域上方形成一种导电类型的表面层(26),并且在源极区域和漏极区域之间的表面层上形成高导电接触(32)。表面层可包括在一种导电类型的高掺杂剂浓度的接触之下的区域(30)。表面接触件(32)可以包括高度掺杂的多晶硅材料,在其表面上具有或不具有金属层。替代地,表面接触件(32)可以包括与表面层接触的阻挡金属和覆盖在阻挡金属上的第二金属。沟道区下面的表面接触和外延层包括用于场效应晶体管的栅极。操作速度的提高归因于表面触点导电性的提高和有限的尺寸,从而降低了表面触点的电容。

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