METHOD FOR SELECTIVE ADDITIVE CORRECTION OF MISTAKES IN COPY LAYERS

摘要

A process is disclosed for the selective additive correction of voids in copying layers, in which electrically conductive aqueous solutions of an organic compound are deposited in the void, with direct current connection between conductive substrate and at least one electrode, and with a current density in the range from 0.01 to 100 A/dm2. The process is preferably carried out using organic polymers with substrates composed of metal, for example, aluminum, in grained and anodized form.