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METHOD FOR MANUFACTURING ELECTRONIC MODULES, IN PARTICULAR FOR MICROCIRCUIT CARDS

机译:用于制造微模块的电子模块的方法

摘要

The microcircuit card comprises an electronic module 1 with standard electrodes 7. To constitute this module, a first unit 5 is manufactured which comprises an insulating substrate 6 covered by the electrodes. Under each electrode is a hole 8. A second unit 9 is then produced which comprises an integrated circuit chip 10 whose connection terminals are connected to conductors 13. One of the free ends 15 of each conductor 13 falls to the right of a corresponding hole 8 of the first unit. The two units are then assembled and the free ends of the conductors of the second unit are welded to the electrodes 7 of the first unit. / P P The module is used to equip, in particular, a microcircuit card of standardized dimensions. / P
机译:该微电路卡包括具有标准电极7的电子模块1。为了构成该模块,制造了第一单元5,该第一单元5包括被电极覆盖的绝缘基板6。在每个电极的下面有一个孔8。然后制成第二个单元9,它包括一个集成电路芯片10,其连接端子连接到导体13。每个导体13的自由端15之一落在相应孔8的右边。第一单元的然后组装两个单元,并且将第二单元的导体的自由端焊接到第一单元的电极7。

该模块特别用于配备标准尺寸的微电路卡。

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