首页> 外国专利> DEVICE FOR SUPPORTING AND THERMALLY CONTROLLING A WORKPIECE AND APPARATUS FOR TESTING PLATES OF SEMICONDUCTOR CIRCUITS INCLUDING SUCH A DEVICE

DEVICE FOR SUPPORTING AND THERMALLY CONTROLLING A WORKPIECE AND APPARATUS FOR TESTING PLATES OF SEMICONDUCTOR CIRCUITS INCLUDING SUCH A DEVICE

机译:用于支持和热控制用于测试包括该设备在内的半导体电路板的工件的装置和设备

摘要

P Device 1 for, by simple contact, supporting and holding a part in position and bringing it to a desired negative or positive temperature, the part being maintained by vacuum effect, comprising: a plate 2 thermally conductor with an upper face 7 having at least one groove 8 in communication with a duct 9, 10 for connection with a source of vacuum gas, parallel enclosures 15 provided in the plate 2 and crossed by flows of thermal adjustment fluid at the above positive or negative desired temperature; and a peripheral chamber 16 surrounding the plate 2 and containing a dry gas under pressure distributed by outlet means 18 distributed peripherally and oriented towards the center of the plate so that the dry gas is directed above the surface of the plate and onto the part supported by it in order to prevent the formation of condensation and frost at low temperatures. /P
机译:

装置1,用于通过简单接触将零件支撑并保持在适当位置,并使零件达到所需的负温度或正温度,该零件通过真空作用保持,包括:板2,其导热体的上表面7具有至少一个与管道9、10连通的槽8,用于与真空气体源连接,在板2中设置有平行外壳15,这些平行外壳被在上述正或负期望温度下的热调节流体流所穿过;外围腔室16围绕着板2,并在由出口装置18分配的压力下包含干燥气体,该出口气体在外围分布并且朝向板的中心定向,使得干燥气体被引导到板的表面上方并到达由板支撑的部分上为了防止在低温下形成冷凝水和霜冻。

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