PURPOSE:To manufacture the title composite excellent in heat resistance, high- degree working resistance, solderability, etc., by coating a base material composed of oxygen-free zirconium copper containing specific amounts of Zr with oxygen-free leaded copper containing specific amounts of lead by a specific percentage. CONSTITUTION:A base material composed of oxygen-free zirconium copper containing 0.005-0.05wt.% Zr is coated by 10-40% by volume ratio with a coating material composed of oxygen-free leaded copper (= about 10ppm oxygen content) containing 0.005-0.5wt.% lead. By this method, the high-conductivity oxygen- free leaded copper-coated zirconium copper composite suitable as material for lead wire for electronic parts, such as diode, can be obtained.
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