PRODUCTION OF COPPER ALLOY FOR IC LEAD FRAME

摘要

PURPOSE:To produce a copper alloy for IC lead frame having high flatness characteristic and reduced in internal strain by subjecting a copper alloy having a specific composition to finish temper rolling, to low-temp. annealing or continu ous annealing, and then to tension leveler straightening. CONSTITUTION:A stock for lead frame composed of a copper alloy having a composition consisting of 0-5wt.% of one or more elements selected from Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zn, Zr, Sn, Mg, Ag, Te, and B and the balance Cu is prepared. The above stock is subjected to finish temper rolling, to low- temp. annealing at 150-400 deg.C for 30-400min or continuous annealing at 250-600 deg.C for 5-300sec, and then to tension leveler straightening at 0.15-1.0% elongation percentage, by which the copper alloy can be produced.