PRODUCTION OF MASK FOR SPUTTERING AND SUBSTRATE WITH PATTERNED COATING FILM FORMED BY SPUTTERING

摘要

PURPOSE:To obtain a mask for sputtering with a high quality coating film for sputtering which is enabled to form accurately the film for sputtering by taperingly chipping a specified width or more at the edge of an opening in the mask from the side to be adhered to the near side of a substrate on which a coating film is formed by sputtering. CONSTITUTION:The edge 11a of an opening in a mask 11 is taperingly chipped to form 11b by =10mum width W from the side to be adhered to the rear side of a substrate 12. Sputtering is carried out as usual with the resulting mask 11 to form a desired coating film 18 in the opening of the mask 11. Since the edge 11a of the opening has been taperingly chipped, electric discharge is not caused at the edge and the edge of the formed coating film 18 is not damaged. The desired coating film 18 whose edge is very sharp can be formed.