RADIATION-CURABLE COVERING COMPOSITION, SOLDER RESIST, AND PLATED RESIST

摘要

PURPOSE:To improve the adhesiveness to copper, moisture resistance, water resistance, chemical resistance, heat resistance, etc., by incorporating a phosphate having unsaturated groups and a talc having a surface treated with a silane having unsaturated groups into a radical-polymerizable prepolymer. CONSTITUTION:A radiation-curable covering composition is obtained by mixing 100 pts.wt. talc (A) (having a mean particle diameter of 5mum or smaller, preferably 1.5-3.5mum) having s surface treated with a silane coupling agent having ethylenically unsaturated double bonds (e.g., methacryloxymethyltrimethoxysilane); 2-80 pts.wt., preferably 5-30 pts.wt., phosphate (B) having one or two ethylenically unsaturated double bonds in the molecule (e.g. bisacryloyloxyethyl phosphate); 20-200 pts.wt., preferably 50-100 pts.wt., radical-polymerizable monomer (C) (e.g., dipentaerithritol hexaacrylate or N-vinylpyrrolidone); and 20-200 pts.wt., preferably 50-100 pts.wt., radical- polymerizable prepolymer (D) (e.g., a bisphenol A epoxy acrylate).