SURFACE MOUNT TECHNOLOGY REPAIR STATION AND METHOD FOR REPAIR OF SURFACE MOUNT TECHNOLOGY CIRCUIT BOARDS

摘要

Abstract of the DisclosureA surface-mount-technology repair station and methodfor replacing components on SMT circuit boards. Thestation includes a base with a controllable heatingelement through which deionized air is blown onto thesurface of a board opposite to the surface on which therepair is to be effected. This raises the temperature ofthe entire board substantially but to a point below themelting point of solder. A second heating elementthrough which deionized air is blown is positioned overthe leads of a selected component positioned on theboard, that is either to be removed from or secured tothe board. The heating of the leads by the secondheating element causes the solder on these leads to melt,thus, enabling replacement of the component. To removethe component, the operator, using an instrument, such astweezers, grasps the component and removes it from theboard. To install a component, the operator, aftermelting solder on the leads, discontinues the heating ofthe component.The method of the present invention includes thesteps of heating the surface-mount-technology boards to asubstantially high temperture, and then heating the leadsof a selected component to be replaced so that the solderdisposed on the leads melts.