Method of connecting two objects together, for example a slice of an insulating material to a slice of a semiconductor material

摘要

A method of connecting two objects, such as for example a slice (1) of an insulating material and a slice (2) of a monocrystalline semiconductor material as employed in semiconductor technology, the objects being provided with complementary optically smooth surfaces (3, 4) and being subse­quently brought into contact with each other with the optically smooth surfaces, causing atomic bonds to be formed between atoms of the two objects. After the objects have been provided with optically smooth surfaces the objects are locally brought into contact with each other in a position in which the optically smooth surfaces occupy a non-parallel position relative to each other, after which the objects are moved relative to each other until the optically smooth surfaces contact each other in a final parallel position.