Grinding tool for cutting semiconductor crystals - consists of disc with central hole and with ring of fixing holes near it periphery with edge of central hole covered with binding material

摘要

The grinding tool, for cutting the crystals used in the manufacture of semi-conductors, consists of a disc (4) with a central hole and with a ring of fixing holes (6) near its periphery. The edge of the central hole is covered with a binding material (2) in which abrasive particles, formed by diamond dust, are embedded by electrolysis and form a cutting edge with a width of 0.3 mm to 0.8 mm. The projection of the cutting edge above the surface of the disc is equal to the diameter of a grain of diamond dust. USE - Manufacture of semi-conductors.