Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process

摘要

During solder-reflow attachment of surface-mount electronic components to a printed circuit board, vibrational energy sufficient to overcome the static coefficient of friction between the leads of a component and their respective connector pads is applied to the board, with the result that the surface tension of the molten solder between the leads and the pads will produce a best-fit alignment of the leads of each component on their corresponding connector pads.