Thermosetting-resin-forming composition from bis-maleimide and diallyl bis phenol

摘要

This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: ##STR1## wherein R represents a divalent group of ##STR2## X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa- fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.