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MANUFACTURING METHOD OF HYBRID CIRCUIT DEVICE HAVING THE SAME ELECTRONIC COMPONENT ARRAY AND CIRCUIT MANUFACTURED BY METHOD THEREOF
MANUFACTURING METHOD OF HYBRID CIRCUIT DEVICE HAVING THE SAME ELECTRONIC COMPONENT ARRAY AND CIRCUIT MANUFACTURED BY METHOD THEREOF
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机译:具有相同电子元件阵列的混合电路装置的制造方法及其电路制造
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摘要
PURPOSE: To provide a matrix-like device (array) where electronic functional parts are mounted at high density by providing cut-off means in the area of a part arrangement on a substrate and opening the electric contact where adjacent functional parts or the pattern conductors are electrically connected over the cut-off means. CONSTITUTION: The obstacles 3 with prescribed sections are attached between the pattern conductors 2 on the substrate 1 by an optical chemical method. The material of the obstacles 3 is electrically insulating and it resembles to cured adhesive to mechanical work as much as possible. An LED 4 are sequentially attached to the pattern conductor 3 between the cut-off means. Epoxy resin to which silver is added is used as conductive adhesive 6, for example. The pattern conductor 2 having a resistance value which is too small is electrically connected to the adjacent pattern conductor 2 and only the shorted pattern conductors are detached at the section face 7. Thus, the array whose mounting density is high can be realized and a functional element with defect is removed.
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