首页> 外国专利> JOINING METHOD OF AU AND AU ALLOY BLANK MATERIAL AND TI AND TI ALLOY BLANK MATERIAL

JOINING METHOD OF AU AND AU ALLOY BLANK MATERIAL AND TI AND TI ALLOY BLANK MATERIAL

机译:AU和AU合金坯料与TI和TI合金坯料的连接方法

摘要

PURPOSE:To form a joint part having high joint strength in the stage of joining an Au or Au alloy blank material and Ti or Ti alloy blank material by forming preliminarily an impregnated layer contg. oxygen or nitrogen or both to the joint surface of the Ti or Ti alloy blank material. CONSTITUTION:The impregnated layer incorporated with oxygen or nitrogen or both at a ratio by weight % of 0.5-15.5% oxygen and 0.1-7% nitrogen is formed on the joint surface of the Ti or Ti alloy blank material. The joint surfaces of the Ti or Ti alloy blank material and the Au or Au alloy blank material are superposed on each other via the impregnated layer. Both blank materials are subjected to a pressurizing and heating treatment in an inert gaseous or vacuum atm. under the conditions of, for example, about 750 deg.C heating temp., above 0.5kg/mm.2 pressurizing force and about 10min heating time by which both materials are diffusion-joined.
机译:用途:通过预先形成一层浸渍层来形成Au或Au合金毛坯材料与Ti或Ti合金毛坯材料接合的阶段,以形成具有高接合强度的接合部。氧或氮或两者结合到Ti或Ti合金毛坯材料的接合表面组成:在Ti或Ti合金毛坯材料的接合表面上形成了以0.5-15.5%的氧气和0.1-7%的氮气的重量比掺入氧气或氮气或两者的浸渍层。 Ti或Ti合金毛坯材料与Au或Au合金毛坯材料的接合表面通过浸渍层彼此叠置。两种坯料均在惰性气体或真空大气压下进行加压和加热处理。在例如约750℃的加热温度,高于0.5kg / mm 2的压力和约10分钟的加热时间的条件下,两种材料扩散接合。

著录项

  • 公开/公告号JPH0353075B2

    专利类型

  • 公开/公告日1991-08-13

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIARU KK;

    申请/专利号JP19840081410

  • 申请日1984-04-23

  • 分类号B23K20/00;B23K20/14;B23K20/233;B23K35/00;

  • 国家 JP

  • 入库时间 2022-08-22 06:03:12

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