首页> 外国专利> METHOD FOR INTEGRALLY MOLDING THERMOSETTING RESIN AND THERMOPLASTIC RESIN AND INTEGRALLY MOLDED ITEM

METHOD FOR INTEGRALLY MOLDING THERMOSETTING RESIN AND THERMOPLASTIC RESIN AND INTEGRALLY MOLDED ITEM

机译:热塑性树脂的一体成型方法及热塑性树脂和一体成型品

摘要

PURPOSE:To make it possible to integrally mold thermosetting resin and thermoplastic resin without adhesive and bonding operation by a method wherein molten resin made of thermoplastic resin is arranged at least on one surface side of board material so as to integrally mold the board material ami the molten resin. CONSTITUTION:A board material 6 made of thermosetting resin is supported on a fixed frame 4 so as to cover a bottom force 2. By moving a top force 3 downwards for mold clamping under the state that the board material 6 is heated up to 180-250 deg.C so as to be supported on the fixed frame 4 under softened state, the peripheral edge of the board material 6 is cut off by the cavity 3a of the top force 3 and the outer edge of the bottom force 2. At this time, molten resin 7 made of thermoplastic resin is fed through the required molten resin course, which is provided on the bottom force 2, between the top surface of the bottom force 2 and the board material 6. Next, by further moving the top force 3 downwards for mold clamping, the molten resin 7 is spread over the whole under surface of the board material 6. At this time, the peripheral edge of the board material 6 is bent to the bottom force 2 side, resulting in wrapping the molten resin 7 by the under surface and the peripheral edge of the board material and consequently producing an integrally molded item 8 by integral molding.
机译:用途:为了能够通过以下方法一体成型热固性树脂和热塑性树脂,而无需进行粘接和粘合操作:将热塑性树脂制成的熔融树脂至少布置在板材的一个表面侧,以便将板材整体成型为熔融树脂。组成:由热固性树脂制成的板材6支撑在固定框架4上,以覆盖底力2。在板材6加热到180-为了在软化状态下将其支撑在固定框架4上,在250℃下,通过顶部力3的空腔3a和底部力2的外缘切断板材6的周缘。此时,将由热塑性树脂制成的熔融树脂7通过所需的熔融树脂层,该熔融树脂层设置在底部力2的顶表面与板材6之间的底部力2上。接着,通过进一步移动顶部力如图3所示,为了使模具合模而向下方下降,熔融树脂7遍及基板材料6的整个下表面散布。此时,基板材料6的周缘向底力2侧弯曲,从而包裹了熔融树脂。 7由下表面和外围边缘板材,因此通过整体模制生产整体模制件8。

著录项

  • 公开/公告号JPH0330923A

    专利类型

  • 公开/公告日1991-02-08

    原文格式PDF

  • 申请/专利权人 HOSOKAWA SEISAKUSHO:KK;

    申请/专利号JP19890166260

  • 发明设计人 HOSOKAWA TOSHIHIRO;ISHITSUBO RIYUUICHI;

    申请日1989-06-27

  • 分类号B29C39/10;B29C39/26;B29C45/14;B29C45/26;B29C45/56;B29C65/70;B29K101/10;B29K105/20;

  • 国家 JP

  • 入库时间 2022-08-22 06:01:22

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