PHOTOTECHNICAL MANUFACTURING PRODUCING FILM SERVING FOR APPLYING ONTO SHEAT POINTS PREVENTING COATING WITH VARNISH SOLDERING POINTS OF PRINTED CIRCUIT PANELS

• 1. 用于在晶粒取向的电工钢板产品上制造绝缘涂层的方法以及涂有这样的绝缘涂层的电工钢板产品 [P] . 中国专利： CN103221556B . 2015.06.24
• 2. 用于在晶粒取向的电工钢板产品上制造绝缘涂层的方法以及涂有这样的绝缘涂层的电工钢板产品 [P] . 中国专利： CN103221556A . 2013-07-24
• 3. Solder resist composition, coating film, coating a printed circuit board, method of manufacturing coating film, and a method for producing a coated printed circuit board [P] . 韩国专利： KR20180002887A . 2018-01-08

  机译： 阻焊剂组合物，涂膜，涂布印刷电路板，涂膜的制造方法以及涂布的印刷电路板的制造方法

• 4. COMPOSITION OF AGENT FOR PREVENTING SOLDERING FLUX CREEPING-UP, COATING FILM FORMING METHOD, PRINTED CIRCUIT BOARD WITH COATING FILM AND ELECTRONIC PARTS [P] . 日本专利： JP2004106056A . 2004-04-08

  机译： 防止焊剂蠕变的代理商的组成，涂层成膜方法，带有涂层的印刷电路板和电子零件

• 5. The process of applying plates striped, particularly printed circuit panels, a coating of varnish. [P] . BR9107017A . 1993-08-24

  机译： 涂有条纹的板（特别是印刷电路板）的过程。

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• 2. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating [O] . Conseil Helene, Jellesen Morten Stendahl, Ambat Rajan 2014
• 3. Method of coating circuit paths on printed circuit boards with solder Patent [R] . Wittmann, A. E. 1967

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