Method of stabilising an organic additive in an acid copper electroplating solution

摘要

An acid copper electroplating solution comprising an organic additive is stabilised by including a transition metal in an amount of not more than 5 g/l, the transition metal being capable of existing in at least two positive oxidation states, but being substantially present in its lowest common positive oxidation state, in the solution.;The organic additive may comprise at least one grain refiner, which may act as a brightener. The transition metal may be selected from at least one of Mn²⁺, Fe²⁺, Cr²⁺ and Ti²⁺.;The electroplating solution may be one from the Copper Gleam 125 series marketed by LeaRonal.