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Platinum/ECA-1500 combination anode coating for low pH high current density electrochemical process anodes

机译:用于低pH高电流密度电化学过程阳极的Platinum / ECA-1500组合阳极涂层

摘要

An anode for use in electroforming copper foil is formed by depositing a multilayer coating on a substrate of a film forming metal. At least one interior layer consists essentially of substantially pore free platinum which is applied electrolytically to a thickness of at least about 5 micrometers (about 200 microinches), and then densified by heat treating in an oxygen containing atmosphere at from 600 to 775 DEG C. At least one of the exterior layers consists essentially of at least 97% iridium oxide and up to about 3% rhodium oxide, which is applied by thermal decomposition of thermally decomposable platinum group metal compounds in an oxygen containing atmosphere at a temperature of not more than about 600 DEG C.
机译:通过将多层涂层沉积在成膜金属的基板上来形成用于电铸铜箔的阳极。至少一个内层基本上由基本上无孔的铂组成,该铂被电解施加至至少约5微米(约200微英寸)的厚度,然后通过在含氧气氛中在600至775℃下进行热处理而致密化。至少一个外层基本上由至少97%的氧化铱和最多约3%的氧化铑组成,它们是通过在不超过200℃的含氧气氛中将可热分解的铂族金属化合物热分解而施加的。约600℃

著录项

  • 公开/公告号EP0215649B1

    专利类型

  • 公开/公告日1991-01-23

    原文格式PDF

  • 申请/专利权人 ENGELHARD CORPORATION;

    申请/专利号EP19860307039

  • 发明设计人 GEUSIC MARK J.;

    申请日1986-09-12

  • 分类号C25D17/10;C25B11/08;

  • 国家 EP

  • 入库时间 2022-08-22 05:54:01

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