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High reliability plastic package for integrated circuits
High reliability plastic package for integrated circuits
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机译:用于集成电路的高可靠性塑料封装
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摘要
A high reliability plastic package (30) which includes palladium plated and solder dipped leads (18) for electrical connection to electrical components as well as a support (10) for electrically contacting a seminconductor integrated circuit device is disclosed. A method for manufacturing such package is also disclosed.
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