ELECTROLYTIC METHOD FOR THE DISSOLUTION OF COPPER PARTICLES FORMED DURING ELECTROLESS COPPER DEPOSITION

摘要

The metal particles of non-adherent copper formed in an electrodeposition bath (3) when the electroless plating of electroless copper on the surface of activated substrate (4) are oxidized and redissolved in this bath. For this we briefly applies a current between an anode member and a cathode immersed in the bath, the anode member (5, 6) being composed of an anode surface (5a, 6a) also parallel and close as possible to the surface bottom of the container (2) containing the bath (3).