首页> 外国专利> Liq. crystal display with capacitive-resistive coupling element - uses electrode of tantalum and dielectric of tantalum-pent-oxide between indium-tin oxide electrode contacting liq. crystal

Liq. crystal display with capacitive-resistive coupling element - uses electrode of tantalum and dielectric of tantalum-pent-oxide between indium-tin oxide electrode contacting liq. crystal

机译:酒带有电容-电阻耦合元件的液晶显示器-在接触铟锡氧化物电极的液体之间使用钽电极和五氧化钽电介质。水晶

摘要

The switching elements, used for active control of image elements in liq-crystal displays, consist of a base electrode, dielectric and counter electrode. The mfg process consists of the following steps: forming a pattern in a Ta-layer (12) deposited on a transparent substrate (10) by etching, pref forming a tapering edge, anodic oxidn of the Ta-layer to form the dielectric layer Ta-pentoxide, first annealing in vacuum, pref for 1 hr at a temp of at least 150 deg C, sputtering of the counter electrode (18), pref In-Sn-oxide, second anneal in oxygen ambient, pref in air for about 1 hr at 250-380 deg C, forming the overlap of the 2 electrodes by defining a photo resist pattern using irradiation of the resist layer, pref udner a sharp angle, through the transparent substrate, etching the counter electrode pattern. Also claimed is the use of a second dielectric layer, pref transparent, pref of Si-oxide, -nitride or -oxynitride, deposited after the first anneal. USE/ADVANTAGE - The process results in a capacitive layer with a defined voltage-current characteristic which can be adjusted by modification of the second anneal. This characteristic is symmetrical wrt polarity and contains a low conductivity region with a width dependent on the second anneal temp. The steepness of the current characteristic above this voltage depend son the dielectric thickness. The process allows these parameters to be adjusted independently and can be easily integrated with the liquid crystal mfg process.
机译:用于主动控制液晶显示器中图像元素的开关元件由基础电极,电介质和对电极组成。制造工艺包括以下步骤:通过蚀刻在沉积在透明基板(10)上的Ta层(12)中形成图案,预形成锥形边缘,对该Ta层进行阳极氧化以形成介电层Ta -五氧化物,首先在真空中退火,在至少150℃的温度下预热1小时,对电极(18)的溅射,In-Sn氧化物预热,在氧气环境中第二次退火,在空气中预热约1在250-380℃下保持hr,通过使用抗蚀剂层的照射限定光致抗蚀剂图案,形成锐利的角度,穿过透明基板,蚀刻两个对电极图案,从而形成两个电极的重叠。还要求保护的是使用第二电介质层,该电介质层是在第一退火之后沉积的,优选是透明的,Si-氧化物,-氮化物或-氧氮化物。使用/优势-该过程会产生具有定义的电压-电流特性的电容层,可以通过修改第二次退火来对其进行调整。该特性是极性对称的,并包含一个低电导率区域,其宽度取决于第二退火温度。高于此电压的电流特性的陡度取决于电介质厚度。该工艺可以独立调整这些参数,并且可以轻松地与液晶制造工艺集成。

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