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Plasma treating conductor plates for electronic elements - with process gas e.g. oxygen, hydrogen, fluoro-(chloro)-hydrocarbon, etc. before soldering
Plasma treating conductor plates for electronic elements - with process gas e.g. oxygen, hydrogen, fluoro-(chloro)-hydrocarbon, etc. before soldering
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机译:电子元件的等离子处理导体板-含处理气体焊接前使用氧气,氢气,氟代(氯)-烃等
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摘要
A process for handling flat components, esp. conductor plates with electronic elements, includes soldering the components together in a soldering machine. The conductor plates are subjected to a plasma pretreatment using a process gas, before soldering takes place. The process gas in pref. O2, H2, Cl2, N2O, N2, Ar, fluorohydrocarbons or chlorinated fluoro-hydrocarbon. ADVANTAGE - The process is simple and economical, and suffers from only minimal flux residue.
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