Wire bond connection system with cancellation of mutual coupling

摘要

In an electrical circuit including a first array and a second array of electrical components mounted on a circuit board having an electrically conductive cladding, there is provided a system for interconnecting the components of the first array to the components of the second array with parallel signal channels for reduction of crosstalk among the channels. In each of the channels, there is one electrically conductive strip formed within the cladding and providing for a path of current in a first direction, and a second conductive path for current in the reverse direction. The second path includes a wire lead formed as a partial loop extending in a plane perpendicular to a plane of the cladding, and also includes a pad formed of material of the cladding and coplanar with the conductive strip. The pad is connected to a terminus of the wire loop. The pad is insulated from the conductive strip and forms therewith a portion of a loop which generates a magnetic field in the presence of currents flowing through the two paths. Magnetic coupling provided by the wire loops has a positive coefficient of mutual inductance which cancels negative mutual inductance of loops lying in a plane of the cladding to reduce crosstalk among the channels.