Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer

摘要

A curable epoxy resin is blended with (a) an alkenyl group- containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture- free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.