Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith
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机译:萘酚酚醛清漆环氧树脂组合物和用其封装的半导体器件
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摘要
A thermosetting resin composition comprising (A) a naphthalene ring- bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.
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