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COUNTER ELECTRODE PLATE FOR ELECTRIC KNIFE AND ELECTRIC KNIFE APPARATUS USING THE SAME

机译:用于电刀的反电极板和使用该电刀的电刀装置

摘要

PURPOSE:To suppress the increase of current density in a non-release part if partially released by forming a sticking layer having anisotropic conductivity showing high conductivity in the thickness direction thereof to the surface layer part of an counter electrode plate and successively laminating a semiconductive layer, a conductive layer and an insulating layer to the rear of the sticking layer. CONSTITUTION:The first semiconductive layer 31, the first conductive layer 41, the second semiconductive layer 32, the second conductive layer 42 and an insulating layer 5 are successively laminated to the rear of the sticking layer 2 of a counter electrode plate 1 through sticking layers 6 and, when the counter electrode plate 1 is partially released, the current-carrying region in the first semiconductive layer 31 of the circuit current from a living body is limited to a non-release part by the enhancement of the anisotropic conductivity possessed by the sticking layers 2, 6 on the surface and rear sides of said layer 31 and the enhancement of the conductivity due to the compression of the sticking layers 2, 6 in the non-release part and the current-carrying region of the second semiconductive layer 32 is also limited to the non-release part and the periphery thereof by the enhancement of the anisotropic conductivity of the respective sticking layers 6 on the surface and rear sides of said layer 32 and that of the conductivity in the non-release part and the substantial resistance values of both semiconductive layers 31, 32 increase and the circuit current is reduced and the increase of the current density in the non-release part is suppressed.
机译:用途:通过在对电极板的表层部分形成厚度方向上具有高导电性的各向异性导电性的粘附层,并依次层压半导电层,以抑制部分释放时电流密度的增加导电层和位于绝缘层后面的绝缘层。组成:第一半导电层31,第一半导电层41,第二半导电层32,第二半导电层42和绝缘层5依次通过粘结层层压在对电极板1的粘结层2的背面如图6所示,当对电极板1被部分地释放时,由于活体具有的各向异性导电性的增强,来自活体的电路电流的第一半导电层31中的载流区域被限制在非释放部分。所述层31的表面和背面上的粘附层2、6以及由于在第二半导体层32的非释放部分和载流区域中的粘附层2、6的压缩而导致的导电性的增强通过增强在表面o和背面o上的各个粘附层6的各向异性电导率,还限于非释放部分及其周边。如果所述层32和非释放部分中的导电率以及两个半导电层31、32的实际电阻值增加,则电路电流减小,并且抑制了非释放部分中的电流密度的增加。

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