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Circuit for measuring the dynamic characteristics of a housing for a high-speed integrated circuit, and method of measuring these dynamic characteristics

机译:用于测量高速集成电路的壳体的动态特性的电路以及测量这些动态特性的方法

摘要

The circuit measures the dynamic characteristics of housings for encapsulating high-speed integrated circuits (1 GHz). It consists of at least two amplifiers (4, 5) integrated onto a semiconductor substrate (3). These amplifiers have the same input and output impedances as those of the high-speed circuit to be encapsulated in the housing. The amplifiers (4, 5) are laid out in such a way that there is no internal coupling. Depending on the particular measurements to be made, the two amplifiers are mounted in parallel (4, 5) or anti-parallel (5, 6). To measure the dynamic characteristics of a housing, a measuring circuit is mounted in a housing and a signal (Ve) is addressed to an input connection (11) of the housing. From the measurement of the signal (Vs) received at an output connection (15), the transmission coefficient (T) and the coupling coefficient (C) are measured. …IMAGE…
机译:该电路测量用于封装高速集成电路(1 GHz)的外壳的动态特性。它由至少两个集成在半导体衬底(3)上的放大器(4、5)组成。这些放大器的输入和输出阻抗与要封装在外壳中的高速电路的输入和输出阻抗相同。放大器(4、5)的布局应确保没有内部耦合。根据要进行的特定测量,两个放大器并联(4、5)或反并联(5、6)安装。为了测量外壳的动态特性,将测量电路安装在外壳中,并将信号(Ve)发送到外壳的输入连接(11)。根据在输出连接(15)处接收到的信号(Vs)的测量,测量传输系数(T)和耦合系数(C)。 …<图像>…

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