METHOD FOR TREATMENT OF DIELECTRIC BEFORE CHEMICAL COPPER-PLATING

摘要

the invention u043eu0442u043du043eu0441u0438u0442u0441u00a0 to unrealized density, in particular ceramics on the basis of u043du0438u0442u0440u0438u0434u0430 u0430u043bu044eu043cu0438u043du0438u00a0 and may be used in electronic industry u0434u043bu00a0 u043du0430u043du0435u0441u0435u043du0438u00a0 copper coating in the production elements u0433u0430u0437u043eu0440u0430u0437u0440u00a0u0434u043du044bu0445 devices and u043fu043eu0437u0432u043eu043bu00a0u0435u0442 reach u043fu043eu0432u044bu0448u0435u043du0438u00a0 corrosion resistance and adhesion to u043fu043eu043au0440u044bu0442u0438u00a0 ker u0430u043cu0438u043au0435.before chemical copperizing ceramics process within 5 to 10 min in solution of the mas.%, u0441u0435u0440u043du0430u00a0 acid 91,87 - 91,17, u0431u0438u0445u0440u043eu043cu0430u0442 u043au0430u043bu0438u00a0 7.5 approached 7.73, u0434u0438u043du0430u0442u0440u0438u0435u0432u0430u00a0 salt u044du0442u0438u043bu0435u043du0434 u0438u0430u043cu0438u043du0442u0435u0442u0440u0430 - acetic acid (u0442u0440u0438u043bu043eu043d b) 0.63 - 1.10. u0430u0434u0433u0435u0437u0438u00a0 copper to the treated surface u043du0438u0442u0440u0438u0434u0430 u0430u043bu044eu043cu0438u043du0438u00a0 4.0 - 6.5 mpa, u043au043eu0440u0440u043eu0437u0438u043eu043du043du0430u00a0 resistance among the 3% of r ra NaCI with 60 & deg; 30 to 35 days. 1, table 2).