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Floor tile laying - uses an adhesive which expands on hardening to take up floor irregularities

机译:地砖铺设-使用一种在硬化时会膨胀的胶粘剂,以解决地板不平整问题

摘要

To lay floor coverings, especially floor tiles, the adhesive used to bond the tile to the floor increases its volume during hardening, to take up irregularities in the floor surface. The adhesive expands under hardening, with the expansion pressure which is not greater than the specific gravity of the floor tile. The adhesive is applied at a rate so that at least 65% of the floor tile surface towards the floor is coated with the adhesive after harden ing. The adhesive is applied in strips either to the reverse surface of the floor tile or to the floor. The volume increase of the adhesive has a selected and defined value so that, with a max. 100% cover on the reverse surface of the tile, the reduction of the thickness through compression as the tile is laid is a max. of 40% of the adhesive thickness on application before the tile is laid. The tile can have a shaped plastics joint to give a keyed bond between the adhesive and the lower edge of the joint. The reverse surface of the floor tile can be fitted with recess strips to hold and align the adhesive and distribute the adhesive evenly over the tile surface. ADVANTAGE - The method gives easy floor tile laying, even when the floor is rough and uneven, to give a smooth floor surface.
机译:为了铺设地板覆盖物,特别是地板砖,用于将瓷砖粘结到地板的粘合剂在硬化过程中增加了其体积,以吸收地板表面的不规则性。粘合剂在硬化下膨胀,膨胀压力不大于地砖的比重。粘合剂的施加速度应使硬化后至少有65%的地板砖表面朝向地板。粘合剂以条状施加在地板砖的反面或地板上。胶粘剂的体积增加具有选定的定义值,以便最大100%覆盖瓷砖的背面,铺设瓷砖时通过压缩减少的厚度最大。在铺设瓷砖之前,应先施加40%的粘合剂厚度。瓷砖可以具有成形的塑料接缝,以在粘合剂和接缝的下边缘之间形成键接。地板砖的反面可以安装凹槽,以固定和对齐粘合剂,并将粘合剂均匀地分布在瓷砖表面。优点-即使地板粗糙不平,该方法也可以轻松铺设地砖,从而使地板表面光滑。

著录项

  • 公开/公告号DE4021863A1

    专利类型

  • 公开/公告日1992-01-16

    原文格式PDF

  • 申请/专利权人 BUCHTAL GMBH 8472 SCHWARZENFELD DE;

    申请/专利号DE19904021863

  • 发明设计人 VERZICHT DES ERFINDERS AUF NENNUNG;

    申请日1990-07-09

  • 分类号E04F15/08;C09J5/08;C09J9/00;C09J175/04;E04F15/12;

  • 国家 DE

  • 入库时间 2022-08-22 05:25:54

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