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Electro plating bath for depositing solid particles dispersed in nickel alloy matrix on sliding surfaces
Electro plating bath for depositing solid particles dispersed in nickel alloy matrix on sliding surfaces
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机译:电镀液,用于将分散在镍合金基体中的固体颗粒沉积在滑动表面上
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摘要
The plating bath is prepared by adding one or more boron compounds, such as trimethylamine-borane, dimethylamine-borane, and sodium borohydride, in an amount of 0.1 to 10 g/l, preferably 1 to 8 g/l, to a nickel electroplating bath comprising an aqueous acidic solution of at least one nickel salt containing micron size particles of at least one water-insoluble material, such as Ni-Si3N4, Ni-SiC, or Ni-WC of eutectic composition. The boron compounds produce better hardness and anti abrasion properties.
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机译:电镀液是通过将一种或多种硼化合物(例如三甲胺-硼烷,二甲胺-硼烷和硼氢化钠)以0.1至10 g / l,优选1至8 g / l的量添加到镍电镀中而制备的该浴包含至少一种镍盐的酸性水溶液,该镍盐的水溶液包含至少一种水不溶性材料的微米级颗粒,例如共晶组成的Ni-Si3N4,Ni-SiC或Ni-WC。硼化合物具有更好的硬度和抗磨性能。
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