ELECTROLESS NICKEL ALLOY PLATING BATHS, A METHOD FOR DEPOSITION OF NICKEL ALLOYS, NICKEL ALLOY DEPOSITS AND USES OF SUCH FORMED NICKEL ALLOY DEPOSITS

摘要

The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state, at least three complexing agents CA1, CA2 and CA3 wherein each of CA1, CA2 and CA3 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned. The present invention further concerns a method for depositing nickel alloy deposits, their use and data storage devices comprising such alloys.