A vapour source for use in any of the following sputtering modes: balanced magnetron, unbalanced magnetron, random cathodic arc and magnetically confined magnetic arc comprises an evaporation target plate 1 of material to be evaporated; a cathode plate 2 mounted to and in electrical connection with the evaporation target and to which electrical power is supplied; an arc containment ring 10 mounted on the evaporation target to confine a cathode arc within an evaporation area of the evaporation target; a magnet assembly, comprising a central magnet 13 located beneath the evaporation area and one or more outer magnets 11 surrounding the central magnet, and means whereby the field strengths at the evaporation area arising from the central magnet and the one or more outer magnets are variable relative to each other; and an electrically conducting shield 5 mounted above the evaporation target and electrically isolated therefrom. The magnet assembly may be designed to move automatically in such a manner so as to allow evaporation of different parts of the target and provide for the deposition of compound or multiple layer coatings. IMAGE
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