Method for improving step coverage of a metallization layer on an integrated circuit by use of molybdenum as an anti-reflective coating

摘要

A method for improving step coverage of metallization layers of an aluminum alloy on an integrated circuit involves use of a deposited layer of molybdenum as an anti-reflective coating to increase the efficient use of laser energy for planarization purposes where the underlying aluminum alloy covers a step, such as an open contact hole or via.