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Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor

机译:具有片外共面波导谐振电感器的倒装MMIC振荡器组件

摘要

A coplanar waveguide based microwave monolithic integrated circuit (MMIC) oscillator chip (14) having an active oscillator element (16) and a resonant capacitor (18) formed thereon is flip-chip mounted on a dielectric substrate (12). A resonant inductor (22) is formed on the substrate (12) and interconnected with the resonant capacitor (18) to form a high Q-factor resonant circuit for the oscillator (10). The resonant inductor (22) includes a shorted coplanar waveguide section (24) consisting of first and second ground strips (24b,24c), and a conductor strip (24a) extending between the first and second ground strips (24b,24c) in parallel relation thereto and being separated therefrom by first and second spaces (26a,26b) respectively. A shorting strip (24d) electrically interconnects adjacent ends of the conductor strip (24a) and first and second ground strips (24b,24c) respectively. A dielectric film (34) may be formed over at least adjacent portions of the conductor strip (24 a) and first and second ground strips (24b,24c). The resonant inductor (22) is adjusted to provide a predetermined resonant frequency for the oscillator (10) by using a laser (40) to remove part of the dielectric film (34) in the first and second spaces (26a,26b) for fine adjustment, and/or to remove part of the shorting strip (24d) at the ends of the first and second spaces (26a,26b) for coarse adjustment.
机译:将具有有源振荡器元件(16)和谐振电容器(18)形成在其上的基于共面波导的微波单片集成电路(MMIC)振荡器芯片(14)倒装芯片安装在介电基板(12)上。谐振电感器(22)形成在基板(12)上并与谐振电容器(18)互连,以形成用于振荡器(10)的高Q因子谐振电路。谐振电感器(22)包括由第一和第二接地条(24b,24c)组成的短路共面波导部分(24),以及在第一和第二接地条(24b,24c)之间平行延伸的导体条(24a)。与其相对应并分别由第一和第二空间(26a,26b)隔开。短路条(24d)分别使导体条(24a)的相邻端与第一和第二接地条(24b,24c)电互连。可以在导体带(24a)以及第一和第二接地带(24b,24c)的至少相邻部分上形成介电膜(34)。通过使用激光器(40)以去除第一和第二空间(26a,26b)中的部分介电膜(34)以精细地调节谐振电感器(22),以为振荡器(10)提供预定的谐振频率。调节,和/或去除短路带(24d)在第一和第二空间(26a,26b)的端部的一部分,以进行粗调。

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