Method for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereon

摘要

In conducting wiring by masking the portion other than the portion to be wired of a metallic laminate with a photoresist for plating and subjecting only the portion to be wired to pattern plating, the provision of a noble metal layer made of gold, platinum or the like, or a metallic layer made of a metal having a larger ionization tendency than that of a metal used in the pattern plating on the metallic layer constituting the undercoat of the photoresist for plating enables the peeling of the resist for plating to be prevented and excellent fine wiring to be conducted.