RESIN COMPOSITION, ADHESION AUXILIARY LAYER FOR PLATING PROCESS, ADHESION AUXILIARY LAYER FOR PLATING PROCESS WITH SUPPORT, LAMINATE FOR WIRING BOARD, METHOD OF PRODUCING LAMINATE FOR WIRING BOARD, MULTILAYER WIRING BOARD, AND METHOD OF PRODUCING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition and an adhesion auxiliary layer for plating process having excellent adhesive force to wiring board prepreg in B stage state.;SOLUTION: A resin composition and an adhesion auxiliary layer for plating process according to the invention comprise (A) polyfunctional epoxy resin, (B) epoxy resin curing agent, (C) phenolic hydroxy group-containing polybutadiene modified polyamide resin, and (D) phosphorus curing accelerator.;COPYRIGHT: (C)2015,JPO&INPIT