首页> 外国专利> ELECTROLESS COMPOSITE PLATING METHOD AND EQUIPMENT THEREFOR

ELECTROLESS COMPOSITE PLATING METHOD AND EQUIPMENT THEREFOR

机译:化学复合镀覆方法及其设备

摘要

PURPOSE: To prevent fine particles from being deposited on the bottom surface in the inside of a plating tank by providing a feed pipe of fluid to the lower part in the inside of the plating tank and moving the feed pipe of fluid along the bottom surface of the plating tank. ;CONSTITUTION: A rockable feed pipe 2 of fluid is provided in the inside of a plating tank 1. When plating liquid 20 is force-fed to a liquid feed pipe 13, plating liquid 20 passes through a vertical part 4a and reaches a horizontal part 3 and is spouted toward the bottom surface from a blowout hole. Fine particles deposited on the bottom surface are raised while being blown off and approach the material to be plated. When a hydraulic cylinder 10 is moved and a link mechanism 11 is driven, a feed pipe 2 of liquid is rocked and displaced as shown by A2, B2 and C2. Since the horizontal part 3 of the feed pipe 2 of fluid is moved along the circular arc-shaped bottom surface by holding the prescribed interval, plating liquid 20 is sprayed in the whole surface of the bottom surface from the blowout hole. The fine particles deposited on the bottom surface are blown off in the whole surface of the bottom surface and removed.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:为了防止细小颗粒沉积在电镀槽内部的底面上,方法是在电镀槽内部的下部提供进料管,然后沿进料槽的底面移动进料管。电镀槽。 ;构成:在电镀槽1的内部设有可摇动的流体进料管2。当将电镀液20强制送入进液管13时,电镀液20经过垂直部分4a并到达水平部分。在图3中,从吹出口向底面喷出。沉积在底表面上的细小颗粒在吹出时会升高,并接近要电镀的材料。当液压缸10运动并且连杆机构11被驱动时,液体的供给管2如A2,B2和C2所示地摇动和移位。由于流体的供给管2的水平部3以规定的间隔沿着圆弧状的底面移动,因此电镀液20从吹出孔喷出到底面的整个面上。沉积在底表面上的细小颗粒在底表面的整个表面上被吹掉并除去。;版权所有:(C)1993,JPO&Japio

著录项

  • 公开/公告号JPH05263261A

    专利类型

  • 公开/公告日1993-10-12

    原文格式PDF

  • 申请/专利权人 NIPPON KANIZEN KK;

    申请/专利号JP19910075760

  • 发明设计人 URABE ISAO;TSURUTA MIKIO;

    申请日1991-03-15

  • 分类号C23C18/52;C23C18/31;

  • 国家 JP

  • 入库时间 2022-08-22 05:21:20

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